Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working

Description

Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working
Inventory # A-19531
Model No: AT/SM Die Prep Kit
Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System
Included Components
Part No: 734202, Rev. A
Part No: F30 Chuck O-Ring
Part No: Retaining Nut
NSK Part No: HGP NZ1
NKS Part No: AFE-CA, X/Y AXIS
NKS Part No: LG2, Z AXIS
This Rudolph Technologies AT/SM Die Prep Kit is used working surplus. Some items do not include visible part numbers. The physical condition is good, but there are signs of previous use and handling.
Sale Details
Item Condition:
Used Working, 90 Day Warranty
Estimated Packed Shipping Dimensions:
L x W x H = 14"x14"x14" @ 8 lbs.
Shipping Terms:
All Domestic and International shipping quotes and/or fees are subject to change due to packaging requirements, custom packing, transport rate fluctuations, and supply chain demands. We will contact you regarding any shipments that require or incur additional after purchase packing fees or rate changes.
Only items pictured are included:
If a part is not pictured, or mentioned above, then it is not included in the sale. Pictured test equipment is not included or available for sale.
For items with multiple quantities:
The pictured item is not necessarily the one that will be sent. Serial numbers or country of manufacture may vary.
Items are sold with a
90-Day Satisfaction Guarantee
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